Compounds and powders

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Compounds are selected depending on the type of material being processed as well as the operation being performed. The chemical components present in the compounds exert an emulsifying, anti-sedimentation, foaming, brightening effect or create a sliding layer on the surface of the material – helpful in polishing operations. Wetting agents present in the compounds reduce surface tension, which significantly facilitates surface processing.

Powders are used with porcelain chips in CEROFIN technology in the wet smoothing stage.

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Application

Types

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Application

Compounds are used for supporting and enhancing the processes in wet finishing
Can be used in magnetic finihsers, round vibratory machines and disc finishing machines
Selected depending on the processed material as well as the process itself
Powders GP10 and GP20 together with porcelain chips CMG are used with polrcelain chips for smooting process

Types

Type

Symbol

Destination

compound

N10E

polishing in stainless steel shots

compound

U11

polishing gold

compound

SZ4

processing of non-ferrous metals (copper, brass, bronze, alpaca)

compound

polishing gold in magnetic finishers and vibratory machines

compound

polishing silver in magnetic finishers and vibratory machines

compound

polishing non-ferrous metals (e.g. copper and its alloys)

compound

V27

corrosion inhibitor for carbon steel

compound

VILUX

polishing gold in magnetic finishers and vibratory machines

compound

silver etching (CEROFIN)

compound

SK6

all-purpose grinding compound

compound

U32

polishing silver (CEROFIN)

compound

all-purpose grinding compound

compound

stainless steel polishing

compound

finishing steel

compound

V10

all-purpose grinding compound

compound

N51

degreasing, washing off polishing pastes

compound

V19

processing stainless steel and non-ferrous metals

powder

GP10

smoothing gold (CEROFIN)

powder

GP20

smoothing silver (CEROFIN)