Ceramic bonded chips are used for intensive grinding of surfaces with a high degree of roughness and should be used wherever it is necessary to remove the excess material from machined workpieces. In the process od deburring they allow for the removal of burrs, blunting and rounding of sharp edges, as well as the removal of surface layers (oxide, fat, etc.).

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Application

  • Ceramic-bonded chips with high density for rough wet grinding of steel alloys with addition of compound

Types

Type

Symbol

Size (mm)

Abrasiveness

Prism oblique

GP20x20

20x20

A, BD *

Prism oblique

GP15x10

15x10

A

Prism oblique

GP15x15

15x15

A

Prism oblique

GP10x10

10x10

BD

Prism oblique

GP6x10

6x10

A, BD

Prism oblique

GP4x4

4x4

BD

Prism

G25x25

25x25

BD

Prism

G15x15

15x15

A, BD

Prism

G10x10

10x10

A

Prism

G6x6

6x6

A, BD

Prism

G4x4

4x4

A, BD

Tristar oblique

STP15x10

15x10

BD

Tristar oblique

STP6x6

6x6

A, BD

Cone

KC15

15x15

A, BD

Ellipse

E10x5x10

10x5x10

A

Ellipse oblique

EP10x5x10

10x5x10

BD

* A - more aggressive, BD - less aggressive